Study of steady-state thermal model for white light LEDs thermal management application at encapsulant level

Authors

  • Trong-Nam Tran
  • Van-Tuan Huynh
  • Thi-Hanh-Thu Vu
  • Nguyet-Thuan Phan
  • Huynh-Tuan-Anh Nguyen
  • Quang-Khoi Nguyen Faculty of Physics and Engineeing Physics, VNUHCM-University of Science https://orcid.org/0000-0002-6456-365X

DOI:

https://doi.org/10.4302/plp.v16i1.1270

Abstract

Thermal management for white LEDs at the encapsulant level is an important task to ensure that the device can operate at a high optical and color performance. In this study, a steady-state thermal model was built wherein the finite element method was employed using MATLAB software to identify the temperature distribution. The spatial temperature distribution of the encapsulant and blue LED die region was easily simulated and predicted. The obtained results are not only helpful in detecting the temperature behavior inside the packaging volume but also meaningful for designing the package configuration.

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Author Biography

Quang-Khoi Nguyen, Faculty of Physics and Engineeing Physics, VNUHCM-University of Science

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Published

2024-04-02

How to Cite

[1]
T.-N. Tran, V.-T. Huynh, T.-H.-T. Vu, N.-T. Phan, H.-T.-A. Nguyen, and Q.-K. Nguyen, “Study of steady-state thermal model for white light LEDs thermal management application at encapsulant level ”, Photonics Lett. Pol., vol. 16, no. 1, pp. 13–15, Apr. 2024.

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